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Advantech SOM-Express Design Guide
44 Chapter 5 Carrier Board Design Guidelines
5.1.2.5 SOM-Express PCI interface supply voltage
The SOM-Express PCI interface is a 3.3 V signaling environment but has 5 V
tolerance for I/O signals. If a universal PCI connector is used at the carrier board, a
jumper design to select Vio for 5 V and 3.3 V is necessary. Otherwise, the suitable
Vio voltage should be designed for a 5 V or 3.3 V connector.
Table 5.6 Add-in Card Supplied Power Selection
Symbol 3.3 V Connector 5 V Connector Universal Connector
Vio 3.3 V 5 V Jumper select
Note:
1. Note the riser card supply voltage and do not plug in the wrong supply
voltage. If a universal connector is used, make sure the Vio jumper setting
is correct when plugged into the riser card.
2. Advantech’s demo carrier board provides a 5 V connector and 5 V Vio for
PCI slots. Plugging a 3.3 V riser card in the wrong direction will cause
carrier board or riser card damage.
5.1.3 Layout Guidelines
The following represents a summary of the routing guidelines for PCI devices.
Simulations assume that PCI cards follow the PCI Local Bus Specification, Revision
2.3, trace length guidelines.
5.1.3.1 PCI Bus Layout Example with IDSEL
The following guidelines apply to platforms with nominal impedances of 55 # ± 10%.
SOM-
Express
Connector
01 2
3
R_IDSEL
R_IDSEL
R_IDSEL R_IDSEL
W1 W2
AD BUS
L1 L2 L3 L4
W1 W2 W2 W2W1W1
AD BUS
AD BUS AD BUS
PCI AD Bus should be routed as daisy chain to PCI expansion
slots
Figure 5-3 PCI Bus Layout Example with IDSEL
- Advantech 1
- Notices 2
- Revision History 2
- Table of Contents 3
- 4 Table of Contents 4
- Table of Contents 5 5
- 6 Table of Contents 6
- Table of Contents 7 7
- 8 Table of Contents 8
- Chapter 1 Introduction 9
- 1.2 Referenced Documents 10
- 2.1 Overview 11
- 2.2 Specifications 13
- 2.2.1 SOM-5780 14
- 2.2.2 SOM-5782 16
- 2.2.3 SOM-DB5700 18
- 2.3 System Resources 19
- 2.3.1 SOM-5780 Resources 19
- 2.3.2 SOM-5782 Resources 22
- 2.4 PCI Routing 25
- 2.5 DC Specifications 25
- 2.5.1 Interface I/O Voltage 25
- 2.5.1.3 Audio 27
- 2.5.1.4 VGA 27
- 2.5.1.5 LCD 28
- 2.5.1.6 IDE 28
- 2.5.1.7 Ethernet 28
- 2.5.1.8 TV-Out Bus 28
- 2.5.1.9 IrDA 28
- 2.6 AC Specification 29
- 2.6.1 PCI-Bus AC Spec 29
- 2.6.3 Audio AC Spec 29
- 2.6.4 VGA AC Spec 29
- 2.6.5 IDE AC Spec 30
- 2.6.6 I2C AC Spec 30
- 2.6.7 SMBus AC Spec 30
- Chapter 3 Pin Assignments 31
- 3.1 Row A 32
- 3.2 Row B 33
- 3.3 Row C 34
- 3.4 Row D 35
- 4.1 Nominal Board Stack-Up 36
- Thickness 37
- 4.3 Alternate Stack Ups 39
- 5.1 PCI-Bus 40
- 5.1.1 Signal Description 40
- 5.1.2 Design Guidelines 41
- Vtest 0.4 Vcc 1.5 V 42
- Tskew 2 (max) 2 (max) ns 42
- 5.1.3 Layout Guidelines 44
- Carrier 45
- 5.1.4 Application Notes 46
- 5.2.1 Signal Description 47
- 5.2.2 Design Guidelines 47
- 5.2.3 Layout Guideline 48
- SOM-Express 49
- USB Connector 49
- 5.2.3.4 Stubs 50
- 5.3.1 Signal Description 51
- 5.3.2 Design Guidelines 51
- 5.3.2.3 Azalia: 52
- Analog Ground 53
- 5.3.3 Layout Guidelines 54
- ± 15% 54
- 5.4 VGA 56
- 5.4.1 Signal Description 56
- 5.4.2 Design Guidelines 57
- 5.4.3 Layout Guideline 57
- VGA Connector 58
- 5.5 LVDS 59
- 5.5.1 Signal Description 59
- 5.5.2 Design Guideline 59
- 5.5.3 Layout Requirements 60
- 5.6 Primary IDE0 61
- 5.6.1 Signal Description 61
- 5.6.2 Design Guidelines 61
- IDE bus IDE cable 62
- Total Max 62
- Length 13 inches 62
- Carrier Board 62
- 5.6.3 Layout Guidelines 63
- 5.7 Ethernet 64
- 5.7.1 Signal Descriptions 64
- 5.7.2 Design Guidelines 64
- LAN Connector 65
- 5.7.3 Layout Guidelines 66
- 5.7.3.2 Transformer 67
- 5.7.3.3 Critical Dimensions 68
- 5.8 TV-Out 70
- 5.8.1 Signal Descriptions 70
- 5.8.2 Design Guidelines 70
- TV DAC Filter 71
- 5.9 Miscellaneous 72
- Carrier board 74
- 5.10 PCI Express Bus 77
- 5.10.1 Signal Description 77
- Pin Signal I/O Description 77
- 5.10.3.1 Differential pairs 81
- Guidelines 82
- L1 L2 L3 Capacitor Value 83
- L1 L2 Capacitor Value 83
- 5.11 Serial ATA 84
- 5.11.1 Signal Description 84
- 5.11.2 Design Guidelines 84
- 5.11.3 Layout Guidelines 85
- 5.12 LPC 87
- 5.12.1 Signal Description 87
- 5.12.2 Design Guidelines 87
- 5.12.3 Layout Guidelines 87
- 5.12.4 Application Notes 88
- 5.12.4.3 LPT/Floppy 89
- 5.12.4.4 EMI Considerations 89
- Parallel Port 90
- 6.2 Design Guidelines 95
- 8.1 Material of Heatsink 101
- 8.4 Grounding Issues 102
- 8.8.1 Vendor List 106
- 8.8.2 Heat-Spreader 106
- 8.8.3 Heat-Sink 107
- 8.8.4 Thermal Pad 108
- M2.5*6 5 109
- M2.5*16 5 109
- Quantity 109
- 8.8.6 Fan 110
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