Advantech MMP3-21 Manual do Utilizador Página 78
- Página / 112
- Índice
- MARCADORES
Avaliado. / 5. Com base em avaliações de clientes
Advantech SOM-Express Design Guide
78 Chapter 5 Carrier Board Design Guidelines
5.10.2 Design Guidelines
5.10.2.1 PCI Express AC Coupling Capacitor
Each PCI Express lane is AC coupled between its corresponding transmitter (TX)
and receiver (RX). Figure 5-43 shows the connection for SOM-Express PCI Express
signals. It is best to place AC coupling capacitors close to the transmitter (TX) of the
SOM-Express board.
Figure 5-43 PCI Express Interconnect Example
We recommend using size 0603 capacitors. Use the exact same package size for the
capacitor on each signal in a differential pair. Table 5-25 shows the PCI Express
capacitor summary.
Table 5-26 PCI Express Capacitor Summary
Type
Value
Tolerance
Placement
Length Matching
Between Differential
Pair
AC Capacitor
75 nF-
200 nF
20%
Recommended to place
close to the transmit side
As close as possible
between the differential
pairs
5.10.2.2 Bowtie Topology Considerations: Untangling Nets
It is possible that when interconnecting PCI Express devices, certain “bowtie” or
signal-crossing scenarios might occur when the link is routed on the PCB. There are
three main types of bow tie scenarios:
(1) TX+, TX- crisscrossing within a pair.
(2) Crossing of transmitter and receiver pairs within a lane.
(3) Crossing of lanes within a link.
The PCI Express specification provides two different features: Polarity Inverse and
Lane Reversal to help system designers overcome the layout difficulties encountered
- Advantech 1
- Notices 2
- Revision History 2
- Table of Contents 3
- 4 Table of Contents 4
- Table of Contents 5 5
- 6 Table of Contents 6
- Table of Contents 7 7
- 8 Table of Contents 8
- Chapter 1 Introduction 9
- 1.2 Referenced Documents 10
- 2.1 Overview 11
- 2.2 Specifications 13
- 2.2.1 SOM-5780 14
- 2.2.2 SOM-5782 16
- 2.2.3 SOM-DB5700 18
- 2.3 System Resources 19
- 2.3.1 SOM-5780 Resources 19
- 2.3.2 SOM-5782 Resources 22
- 2.4 PCI Routing 25
- 2.5 DC Specifications 25
- 2.5.1 Interface I/O Voltage 25
- 2.5.1.3 Audio 27
- 2.5.1.4 VGA 27
- 2.5.1.5 LCD 28
- 2.5.1.6 IDE 28
- 2.5.1.7 Ethernet 28
- 2.5.1.8 TV-Out Bus 28
- 2.5.1.9 IrDA 28
- 2.6 AC Specification 29
- 2.6.1 PCI-Bus AC Spec 29
- 2.6.3 Audio AC Spec 29
- 2.6.4 VGA AC Spec 29
- 2.6.5 IDE AC Spec 30
- 2.6.6 I2C AC Spec 30
- 2.6.7 SMBus AC Spec 30
- Chapter 3 Pin Assignments 31
- 3.1 Row A 32
- 3.2 Row B 33
- 3.3 Row C 34
- 3.4 Row D 35
- 4.1 Nominal Board Stack-Up 36
- Thickness 37
- 4.3 Alternate Stack Ups 39
- 5.1 PCI-Bus 40
- 5.1.1 Signal Description 40
- 5.1.2 Design Guidelines 41
- Vtest 0.4 Vcc 1.5 V 42
- Tskew 2 (max) 2 (max) ns 42
- 5.1.3 Layout Guidelines 44
- Carrier 45
- 5.1.4 Application Notes 46
- 5.2.1 Signal Description 47
- 5.2.2 Design Guidelines 47
- 5.2.3 Layout Guideline 48
- SOM-Express 49
- USB Connector 49
- 5.2.3.4 Stubs 50
- 5.3.1 Signal Description 51
- 5.3.2 Design Guidelines 51
- 5.3.2.3 Azalia: 52
- Analog Ground 53
- 5.3.3 Layout Guidelines 54
- ± 15% 54
- 5.4 VGA 56
- 5.4.1 Signal Description 56
- 5.4.2 Design Guidelines 57
- 5.4.3 Layout Guideline 57
- VGA Connector 58
- 5.5 LVDS 59
- 5.5.1 Signal Description 59
- 5.5.2 Design Guideline 59
- 5.5.3 Layout Requirements 60
- 5.6 Primary IDE0 61
- 5.6.1 Signal Description 61
- 5.6.2 Design Guidelines 61
- IDE bus IDE cable 62
- Total Max 62
- Length 13 inches 62
- Carrier Board 62
- 5.6.3 Layout Guidelines 63
- 5.7 Ethernet 64
- 5.7.1 Signal Descriptions 64
- 5.7.2 Design Guidelines 64
- LAN Connector 65
- 5.7.3 Layout Guidelines 66
- 5.7.3.2 Transformer 67
- 5.7.3.3 Critical Dimensions 68
- 5.8 TV-Out 70
- 5.8.1 Signal Descriptions 70
- 5.8.2 Design Guidelines 70
- TV DAC Filter 71
- 5.9 Miscellaneous 72
- Carrier board 74
- 5.10 PCI Express Bus 77
- 5.10.1 Signal Description 77
- Pin Signal I/O Description 77
- 5.10.3.1 Differential pairs 81
- Guidelines 82
- L1 L2 L3 Capacitor Value 83
- L1 L2 Capacitor Value 83
- 5.11 Serial ATA 84
- 5.11.1 Signal Description 84
- 5.11.2 Design Guidelines 84
- 5.11.3 Layout Guidelines 85
- 5.12 LPC 87
- 5.12.1 Signal Description 87
- 5.12.2 Design Guidelines 87
- 5.12.3 Layout Guidelines 87
- 5.12.4 Application Notes 88
- 5.12.4.3 LPT/Floppy 89
- 5.12.4.4 EMI Considerations 89
- Parallel Port 90
- 6.2 Design Guidelines 95
- 8.1 Material of Heatsink 101
- 8.4 Grounding Issues 102
- 8.8.1 Vendor List 106
- 8.8.2 Heat-Spreader 106
- 8.8.3 Heat-Sink 107
- 8.8.4 Thermal Pad 108
- M2.5*6 5 109
- M2.5*16 5 109
- Quantity 109
- 8.8.6 Fan 110
Manuais e produtos relacionados com Barebones PC/estação de trabalho Advantech MMP3-21
(30 páginas)© 2020, manymanuals-pt.com. Todos os direitos reservados. | 0.046 s |
Manymanuals.com
Manymanuals.de
Manymanuals.fr
Manymanuals.it
Manymanuals.pl
Manymanuals.cz
Manymanuals.es
Manymanuals-pt.com
Comentários a estes Manuais